Armor design for perfect protection Aluminum alloy heat sink with high performance High thermal conductive adhesive Supports Intel & AMD motherboards Selected high-quality IC Supports XMP2.0 Energy saving with ultra-low working voltage 3600MHz 16GB Kit CL18-22-22-42 28 800 MBs 1.35V 288 Pin Unbuffered DIMM Non ECC
Latest Ryzen 3000 series processor and X570 motherboard tested under complete compatibility and stability) Armor design for perfect protection Aluminum alloy heat sink with high performance High thermal conductive adhesive Selected high-quality IC OC Profile Support Energy saving with ultra-low working voltage
Latest Ryzen 3000 series processor and X570 motherboard tested under complete compatibility and stability) Armor design for perfect protection Aluminum alloy heat sink with high performance High thermal conductive adhesive Selected high-quality IC OC Profile Support Energy saving with ultra-low working voltage