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Full coverage water block cooling position cooling location: GPU core, memory RAM, power supply chip MOS, inductance and tantalum capacitance, other components with high heat output The water block radiation principle the purest cooper back plate fully cover high heating components such as GPU core, Memory RAMPower chip NOS, tantalum capacitors and so on. Through liquid flow take away the heat that us conducted to the water block to achieve cooling purpose which make sure players could have a good game experience and the PC remain stable overclocking performance Equipped with aluminum alloy back plate equipped wih aluminum alloy backboard, it can provide akk aspects of protection for GPU and bring stringappearance and the effiency of heat dispersion to GPU. The size of backboard is close to the length of GPU PCB, leaving more space for case to expand other hardware
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